Project: SERDES Chip for Space Applications
| Acronym | SECHIS (Reference Number: 11270) |
| Duration | 01/12/2017 - 31/05/2020 |
| Project Topic | The main goal of the SECHIS project is to investigate the architectures for high speed serial interfaces using European microelectronics technologies and the implementation of a radiation hardened SERDES chip for use in space environment. The main project result will be a SERDES (Serializer/Deserializer) chip with a throughput over 2Gbps, implemented on IHP’s cutting edge technologies and ready for qualification. |
| Network | Eurostars 2 |
| Call | Eurostars Cut-Off 7 |
Project partner
| Number | Name | Role | Country |
|---|---|---|---|
| 1 | ARQUIMEA INGENIERIA S.L.U. | Coordinator | Spain |
| 2 | ARQUIMEA DEUTSCHLAND GmbH | Partner | Germany |
| 3 | IHP GmbH | Partner | Germany |