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Project Topic
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COMPACT project aims to develop a new manufacturing technology method to build electronic modules without using solder alloy, but materials like conductive paste or ink, resin, electroless copper. The proposed technology might allow to manufacture cheaper and more reliable electronic modules since all the problems caused by the solder joints (defects like cracking, whiskers, tombstoning, voiding, a.s.o.), and by the process (delamination, higher thermal stress of the components), will disappear. COMPACT involves less energy-consuming processes thus contributing to the environment protection. In order to achieve its objectives, COMPACT combines two processes, the printed circuit board fabrication and the electronic components assembly, into one in which the electronic module is built layer-by-layer, electronic components placement and interconnection structure, by using other processes (e.g:printing, curing, encapsulation, copper deposition) with existing equipment. COMPACT allows to get robust electronic modules, fully protected to dust, chokes and humidity. It is expected that the first applications will be for harsh environments, underground (traffic/parking sensors), navy, space
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