Project: Hybrid Photonic Integrated Circuit assembly via flexible waveguides

Acronym FLEXFIX (Reference Number: 12495)
Duration 01/11/2018
Project Topic This project will deliver an assembly process for Photonic Integrated Circuits (PIC) which integrates the functionality of Indium Phosphide (InP) and SiN based TriPleX in a cost effective manner. Flexible waveguides on TriPleX and corresponding guiding structures on the InP will be combined with the assembly process and equipment of ficonTEC to result in a self aligning PIC assembly. Schematically shown in a picture in technical annex 2.
Network Eurostars 2
Call Eurostars Cut–off 9

Project partner

Number Name Role Country
1 LioniX International Coordinator Netherlands
2 ficonTEC Partner Germany
3 Technische Universiteit Eindhoven Partner Netherlands