Project: Metrology of electrothermal coupling for new functional materials technology

The automotive, energy, and medical industries all require high temperature functional materials to increase efficiency. New solid-state cooling techniques are currently being developed for computer chips and for domestic refrigeration using electrocaloric materials, however these are not yet supported by reliable measurements. This project will develop reliable, accurate and traceable measurements of electro-thermal-mechanical coupling at high temperatures in order to support new functional material technologies, such as electrocaloric materials and the products that use them. The project will lead to the development of new technologies for more efficient and reliable transport and power generation, for example, through piezoelectric control of fuel flow in aero-engines and high temperature sensing and integrity monitoring in steam facilities. It will also enable new solid state cooling technologies to reduce greenhouse gas emissions from refrigeration and enable faster electronics thorough on-chip thermal management.

Acronym NEW09 METCO (Reference Number: NEW09)
Duration 01/06/2012 - 31/05/2015
Project Topic Metrology
Project Results
(after finalisation)
See Website
Website visit project website
Network EMRP
Call EMRP Call 2011 - Health, SI Broader Scope and New Technologies

Project partner

Number Name Role Country
1 NPL Management Limited Coordinator United Kingdom
2 Cesky Metrologicky Institut Partner Czech Republic
3 Laboratoire national de métrologie et d'essais Partner France
4 Teknologian tutkimuskeskus VTT Oy Partner Finland
5 Physikalisch-Technische Bundesanstalt Partner Germany
6 aixACCT Systems GmbH Observer Germany
7 University of Leeds United Kingdom