Project: Microwave Integrated circuits for new generation of GaN packaged MMICs (Microwave Monolithic Integrated Circuits).
The huge competitive boost of emergent countries at world wide level, such as China and India, which can offer very low labor costs along with high level technologies, greatly raise the challenge level to western countries which suffer to COtain their own leadership._x000D_In addition there is a trend of the CO telecommunication companies to move production and development activities toward such countries._x000D_In this scenario UMS and MEC do strongly consider necessary and vital to bet on technology excellence and design skills, allowing to considerably raise the added value of MMIC circuits for the future generation of Radio Links , Base Stations and Sat.com (up link for satellite communications)._x000D__x000D_CO objectives of this project are the refinement of GaN technological processes, definition and characterization of adequate packages hosting the related MMIC designed and developed by UMS and MEC, realization of packaged components as demonstrators._x000D__x000D_The achievement of such results will lead to build a more compact, better performing, reliable and cost effective microwave module, to be used in the next generation of mobile telecommunication systems._x000D_MEC, small enterprise (SE), leader in the field of microwave microelectronics design, which also relies on the external support of Bologna and Ferrara Universities, team up for this project with UMS, European compound semiconductors foundry leader, to form the Consortium._x000D_The two Ps have been cooperating since many years, being expertise and know-how of each one strongly complementary. We rely also on this point to succeed in the project._x000D_The heritage in these specific technologies (compound semiconductors) and in such application fields as telecommunication market, brought by UMS and MEC srl (the Consortium) is essential in this project, for the right understanding of telecommunication companies needs._x000D_These latter are very demanding in terms of performances, compactness, reliability and hugely sensitive to cost reduction, since they have to face a world wide competition more and more aggressive._x000D_The multi-year activity of UMS as first European supplier of telecommunication market is a reason more to guarantee that the technology to be developed under this project is the most adequate answer to the above demanding market._x000D_The base properties of the GaN technology have already demonstrated in this last decade to be the new leading edge for the next technological step in the frame of microwave active components._x000D_In fact GaN can guarantee not only a high level of power density (up to 20X compared to GaAs) and efficiency, but also very interesting behavior in terms of linearity and noise figures, which are essential in the telecommunication field._x000D_The CO targets of the proposed research are the design, production and delivery of 100 watt packaged_x000D_HPAs from S to C- Band. They will be based on two possible solutions: packaged pre-matched GaN bars and a packaged chip set exploiting discrete bars for the power and a MMIC gain chain. The products will be suitable for a customer market composed of Base Station BTS, Satcom, Telecom and Broadcasting companies._x000D__x000D__x000D_
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Acronym
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MIGaN
(Reference Number: 4659)
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Duration
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02/03/2009 - 31/01/2013
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Project Topic
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Aim of this project is to improve and master the technology of packaged GaN MMICs, COly devoted to telecommunication market. Higher performances, huge cost reduction and improved reliability, versus silicon or GaAs technology used in the today's apparata, will be the target of the project.
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Network
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Eurostars
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Call
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Eurostars Cut-Off 2
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Project partner
