Project: Laser-assisted low-stress Reflow Bonding of optoelectronic Components

We want to investigate a laser assisted reflow bonding process for photonic components aiming for increased accuracy and component density for smaller package sizes to address novel products and new markets. This will be enabled by transmission laser soldering with absorption of laser radiation localized to the bond zone. We will generate process knowledge for automated bonding and an integrated process chain from component to package for economic, high throughput, and high yield manufacturing.

Acronym LaReBo (Reference Number: 10419)
Duration 01/09/2016 - 01/09/2018
Project Topic Industrial Manufacturing, Material And Transport
Network Eurostars 2
Call Eurostars Cut-Off 5

Project partner

Number Name Role Country
24006 ficonTEC Service GmbH Coordinator Germany
24007 Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung e.V. Partner Germany
24008 QSI Co., Ltd. Partner Korea, Republic of